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Purpose – To give an introductory overview of the key issues that need to be addressed when manufacturing PCBs in China for the European market. Design/methodology/approach – The paper gives an overview of key issues impacting manufacturers supplying printed circuit boards into Europe. The...
Purpose – To investigate the relationship between intermetallic compound (IMC) formation and solderability for immersion tin deposit under different number of reflows. Design/methodology/approach – Scanning Auger microscopy and X‐ray photoelectron spectrometer surface analysis techniques...
Purpose – To study the influence of temperature on the electroplating efficiency of various metals from ionic liquids. Design/methodology/approach – Copper, silver, nickel and tin, in the form of metal chlorides, were dissolved in a number of ionic liquids. After using cyclic voltammetry to...
Purpose – To give an overview of the mechanisms by which brominated flame retardants (BFRs) used in the electronics industry enter, and are transported, in the environment. The potential impacts of BFRs on living organisms are also outlined. Design/methodology/approach – The paper provides an...
Purpose – To present an update and the latest results from work on a project aimed at enabling printed circuit board (PCB) manufacturing to become more sustainable. Design/methodology/approach – Various individual treatment technologies were studied individually under laboratory conditions...
Purpose – To give an overview of the main needs of PCB manufacturers and to show how these needs can be met using laser direct imaging (LDI) technology. Design/methodology/approach – This paper has been written to provide a review of current needs of PCB manufacturers in different product...
Purpose – To introduce the four key industry roadmaps used by the electronics industry and to illustrate which parts of the supply chain each serves. Design/methodology/approach – A comparison of the coverage of the iNEMI, ITRS, Jisso and IPC roadmaps. Findings – It is apparent that the...
Purpose – To give an overview of the problems that can occur with base laminate materials when converting to lead‐free soldering and to give guidance on possible solutions. Design/methodology/approach – The paper contains a number of correlations between different physical measurements and...
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