Select All | Select None
You can now keep track of new articles from Circuit World on your personalized homepage!
Purpose – Aims to explain the main requirements for printed circuit boards (PCBs) and to determine the survival rate of boards in lead‐free assembly. Design/methodology/approach – The first two main requirements are the survival of 5‐6 cycles lead free reflow with peak temperatures of up...
Purpose – There are many considerations that have to be taken into account when balancing the properties epoxy‐based laminate and prepreg materials must have in order to meet the array of electrical, thermal and mechanical demands of today's multilayer printed circuit boards. Aims to discuss...
Purpose – This paper aims to explain how the goals have been met to manufacture rigid‐flex printed circuit boards (PCBs) in equipment used for rigid PCBs by utilizing new materials and process combinations. Design/methodology/approach – A discussion of the technology and applications....
Purpose – To provide information about latest product developments to address and take away the fear of whisker formation on pure immersion tin surface finishes on PCBs. Design/methodology/approach – This paper summarises the latest findings on whisker formation of pure tin surface finishes...
Purpose – To review opportunities for use of digital printing in the printed circuit board (PCB) industry and to introduce background to ink jet printing, process development and applications in order to reduce costs, enhance efficiency and to enable PCB producers to operate in a more...
Purpose – To discuss the validity of the water break test, commonly used as a means of cleanliness determination in the printed circuit fabrication industry. Design/methodology/approach – To examine qualitatively the physics of water‐wetting of solid substrates and their energy levels and...
Purpose – To review the challenges confronting the electronics interconnection industry as it transitions into the gigahertz frequency range and to describe novel prospective solutions designed to circumvent the problems by means of alternative interconnection architectures while remaining...
results per page
Save this article to read later. You can see your Read Later on your DeepDyve homepage.
To save an article, log in first, or sign up for a DeepDyve account if you don't already have one.
Sign Up Log In
To subscribe to email alerts, please log in first, or sign up for a DeepDyve account if you don't already have one.
Read and print from thousands of top scholarly journals.
Sign up with Facebook
Sign up with Google
Already have an account? Log in
To get new article updates from a journal on your personalized homepage, please log in first, or sign up for a DeepDyve account if you don't already have one.