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Multi‐layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry recently. This paper reports an evaluation of this surface finish from the perspective of solder joint attachment...
“A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help the reader understand this remarkable interconnection technology and appreciate just how widely the technology can...
Polymer thick film (PTF) technology provides the lowest cost, cleanest and most efficient manufacturing method for producing flexible circuits. Non‐contact radio frequency (RF) smart cards and related information transaction devices, such as RFID tags, appear to be a good fit for PTF‐flex....
Studies immersion gold over electroless nickel, immersion gold over electroless palladium, immersion gold over electroless palladium over electroless nickel, immersion gold over immersion silver and immersion silver. In the palladium finishes, two palladium thicknesses were evaluated: 10‐12 ॖ...
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers of copper and are manufactured...
Ball grid array (BGA) component packages challenge the circuit board design with signal routing and layout, creating in some cases extra board layers and added vias all resulting in increased costs for the printed circuit board (PCB). As component densities increase and microBGA ( ॖ BGA) and...
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