Select All | Select None
Login failed. Please try again.
Forgot your password?
Log in with Facebook
Log in with Google
You can now keep track of new articles from Circuit World on your personalized homepage!
Multi‐layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry recently. This paper reports an evaluation of this surface finish from the perspective of solder joint attachment...
“A patterned arrangement of printed wiring utilizing flexible base material with or without flexible coverlayers”. The balance of this brief article will hopefully serve to help the reader understand this remarkable interconnection technology and appreciate just how widely the technology can...
Studies immersion gold over electroless nickel, immersion gold over electroless palladium, immersion gold over electroless palladium over electroless nickel, immersion gold over immersion silver and immersion silver. In the palladium finishes, two palladium thicknesses were evaluated: 10‐12 ॖ...
Polymer thick film (PTF) technology provides the lowest cost, cleanest and most efficient manufacturing method for producing flexible circuits. Non‐contact radio frequency (RF) smart cards and related information transaction devices, such as RFID tags, appear to be a good fit for PTF‐flex....
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers of copper and are manufactured...
Ball grid array (BGA) component packages challenge the circuit board design with signal routing and layout, creating in some cases extra board layers and added vias all resulting in increased costs for the printed circuit board (PCB). As component densities increase and microBGA ( ॖ BGA) and...
results per page
Save this article to read later. You can see your Read Later on your DeepDyve homepage.
To save an article, log in first, or sign up for a DeepDyve account if you don't already have one.
Sign Up Log In
To subscribe to email alerts, please log in first, or sign up for a DeepDyve account if you don't already have one.
Read and print from thousands of top scholarly journals.
Sign up with Facebook
Sign up with Google
Already have an account? Log in
To get new article updates from a journal on your personalized homepage, please log in first, or sign up for a DeepDyve account if you don't already have one.