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The effects of ultrasonic agitation on electronic components during PCB cleaning has long been the subject of controversy. This paper summarises the results of a series of studies into these effects for a range of components using CFC, aqueous and semiaqueous cleaning media. The variations with...
In the fiercely competitive environment of printed circuit manufacturing, price undercutting has become the normal marketing tool. While selling prices are being influenced by the competition, much is still within the control of the supplier as long as a sound policy of product costing is...
Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The consequences of these differences are highlighted for the PWB manufacturer.
This study describes how the copper deposition rate and the degree of copper coverage in the holes on printed circuit boards were investigated. The composition of the chemical copper solution was varied, and consequently the deposition parameters were changed. By using Taguchi methods, the level...
For TAB tapes and flex circuitry, laminates with adhesives 3layer laminates are commonly used. The drawbacks of adhesives are well known. Adhesiveless flexible copperpolyimide laminates 2layer laminates could avoid such disadvantages. Twolayer thin film laminates may be produced using sputtering...
The trend towards high speed digital processing has stimulated the need for new substrate materials with superior electrical properties for multilayer printed wiring board PWB applications. Two important electrical substrate parameters are dielectric constant and dissipation factor. This study...
In this study, the reliability of solder joints and platedthrough hole copper padsbarrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The crosssections of the reworked PGA assemblies before and after fatigue tests are also provided for a better...
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