1 - 10 of 17 articles
Multilayer boards for highspeed digital applications are no longer solely substrates for the electrical interconnections needed but play an active role regarding the overall performance of electronic assemblies. In the general part of this paper all the important parameters regarding achievable...
The need for high packing density has led to a requirement for photoimageable solder masks, and the increase in surface mount technology is rapidly expanding the use of these systems into consumer electronics in addition to the traditional hightechnology outlets. This paper compares the...
New from Design Environmental is a range of advanced design HumidityTemperature Test Chambers. Although the machines offer a very high specification in terms of equipment and performance, the employment of the latest production techniques has kept the cost to a minimum.
This twoweek course held in May 1987 at Oxford University Department for External Studies comprised an interesting and comprehensive programme of instructive lecture sessions combined with company visits which gave attendees the opportunity to observe practical aspects of several areas of the...
This paper is intended as a guide towards increasing the reliability of electronics assemblies, particularly SMAs, by going through the stages of production and examining the contamination sources. A particular accent has been put on the local situation in Central Europe, where the materials and...
Low dielectric constant printed circuit board materials are becoming available. There are four or more materials that can produce boards with a dielectric constant of 28. This paper will discuss the electrical and system advantages of having a lower dielectric constant, and the advantages and...
Increasing power densities within electronic equipment have led to a rise in the number of heat related problems being experienced. This paper describes the use of computerised thermal analysis techniques to optimise the design of passive thermal management systems for electronic equipment.
A new treatment method for the copper innerlayers of polyimide multilayer printed wiring boards has been developed. Conventional oxide coatings experience acid penetration through the bonding interface during throughhole plating pretreatment. This problem was eliminated by substitution of...
Celebrating in 1987 thirty years of activity, predominantly in the field of electroless chemicals for the printed circuit industry, the Shipley organisation worldwide can justifiably claim to have fulfilled and to continue to fulfil the original company slogan cited above.
Over the past ten years, there has been continuing development of coupling agent technology and the utilisation of these materials in treating reinforcing fibres in composite manufacture. This paper reviews these developments and examines both the chemistry and the methods used in analysing the...
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