1 - 6 of 6 articles
This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests.Design/methodology/approachThis paper uses 200-µm pitch silicon flip chips with...
The emulation of synapses is essential to neuromorphic computing systems. Despite remarkable progress has been made in the two-terminal device (memristor), three-terminal transistors evoke greater attention because of the controlled conductance between the source and drain. The purpose of this...
This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging.Design/methodology/approachWith the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high...
This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined “internal” thick laminates will be suitable for...
The purpose of this study is to find a new design that can increase the sensitivity of the sensor without sacrificing the linearity. A novel and very efficient method for increasing the sensitivity of MEMS pressure sensor has been proposed for the first time. Rather than perforation, we propose...
The purpose of this paper is to investigate the effect of high-k material HfO2 as a buffer layer for the fabrication of metal-ferroelectric-insulator-silicon (MFeIS) structures on Si (100) substrate.Design/methodology/approachRF-sputtered Pb[Zr0.35Ti0.65]O3 or (PZT) and plasma-enhanced atomic...
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