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This paper deals with the investigations carried out on the variation of current noise (1/ f noise) in polymer thick film resistors, when they are subjected to pulse voltage trimming. The current noise is measured in terms of noise index (micro volts of noise per volt of DC applied, in a decade...
This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin‐on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to...
We have solved the two‐dimensional Poisson's equation for short‐channel device under the assumption that even in the absence of drain‐to‐source voltage ( V DS ), a potential occurs at the edges (source/drain) due to discontinuity at the semiconductor – channel interface in addition to...
Liquid encapsulation techniques have been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity‐filling, and glob top encapsulation. Because of the advanced encapsulation materials and the automatic liquid dispensing equipment involved, it is very...
A single wafer silicon condenser microphone with a novel single deeply corrugated diaphragm is presented in this paper. The microphone diaphragm with corrugation depth of 100 μ m is only 1 mm 2 in area, while the open‐circuit sensitivity as high as 9.8 mV/Pa under a bias voltage of 6 V has been...
New analytical approximation for the frequency‐dependent impedance matrix components of symmetric VLSI interconnect on lossy silicon substrate are derived. The results have been obtained by using an approximate quasi‐magnetostatic analysis of symmetric coupled microstrip on‐chip interconnects on...
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