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Besides combinational circuits, sequential circuits, for instance, flipflops, also play an important role in the design of digital systems. In this article, energyrecoveryadiabatic flipflops based on improved PAL2N logic with complementary pass transistor logic CPL evaluation tree CPAL family...
Investigations were aimed at evaluation of assembly properties of conductive layers cofired with LTCC substrates. The usefulness of these layers for lowtemperature soldering, joining with adhesives or for wire bonding was tested. The samples were manufactured from inks and glassceramic sheets...
This article shows that irradiation with neutrons can be used as solution to harden commercial COTS CommercialOffTheShelf nchannel power MOSFET Metal Oxide Semiconductor Field Effect Transistor devices against destructive events induced by heavy ion irradiation. Atomic displacements created in...
A review of the dielectric measurement techniques that are currently available for the characterization of thick film and LTCC materials at microwave and millimeter wave frequencies is presented. The intention is to show the relative advantages and limitations of the various methods, and to...
The continuously powered response of dissolved oxygen sensors fabricated as screen printed devices has been investigated. A reduction in the sensitivity of these devices has been observed when they are continuously powered at potentials of 0.6V versus AgAgCl reference electrodes. Periodically...
Thick printing Cu and Ag conductors have been developed specifically for use in power applications where excellent printing, thermal, electrical, wire bonding and soldering properties are prerequisite. Efficient thermal management can require fired films on alumina in excess of 150m and often...
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