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The embedding of passive components such as resistors, capacitors and inductors within printed circuit boards PCBs is motivated, to a large extent, by the desire for increased miniaturisation of electronic goods. However, resistors and, to a lesser extent, inductors are heat generating devices,...
Reports the design, fabrication and packaging of a micromachined siliconPyrex based chip for the polymerase chain reaction PCR. The anodic bonding method is used for sealing the chambers of 1l volume with a Pyrex glass wafer. Platinum resistors on the back of the wafer are used as heaters and...
Discusses three simple and lowcost flip chip assembly processes. First, flip chip on board using nonconductive adhesive is evaluated. This process can give reasonable reliability and high assembly yield, when the parameters for epoxy placement and bonding are optimised. Second, the flip chip...
The thin film multilayer multichip module technology MCMD was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF and microwave circuits with integrated passive...
The concept of packaging integrated circuits while they are still in wafer form has captured the imagination of semiconductor manufacturers and packagers around the globe. One such concept, referred to as wide area vertical expansion WAVETM technology promises to provide a relatively easy method...
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