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Describes the modification of a laboratory flipchip bonder to allow bonding of very large chips. The original optical system of the bonder was designed for chip sizes up to 5.0 5.0mm2. It was desired to use the system for bonding chips larger than this, up to 23.0 23.0mm2. Therefore a...
Microwave modules and hybrid circuits have some unique requirements that demand extremely precise dispensing and placement, delicate handling and well controlled curing or reflow. Assembly of these products can be challenging and defects may result in laborintensive manual assembly methods. A...
Recent progress in the investigation of the material parameters of AlAl2O3systems leads to an increase in the possibilities for using embedded TaOXN1X layers. The use of Alsheets as mechanical strength carriers in combination with vacuumdeposited Allayers and electrochemically anodized Al2O3...
High performance aluminium nitride water cooled heat sinks were fabricated and characterized. A variety of fabrication processes were employed to meet different cooling requirements. They include laser cut microchannel coolers for chip and multichip heat sinks as well as dry pressed pin fin heat...
This paper examines the introduction of selfmanaging teams into a high technology workplace. The paper looks at the managerial and organizational implications of developing teams in what was considered a high technology environment where the physical restrictions of manufacture were assumed to...
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