1 - 10 of 11 articles
Interactions between stainless steel and silver and gold based thick film conductors and YBa2Cu3O7 thick film superconductors were studied by SEM and EDX. The stainless steel reacted with the superconducting layer, forming a BaFeO compound on the interface, while BaOdepleted YBa2Cu3O7 compound...
Tape Automated Bonding TAB is a modern technology which meets the requirements for microconnecting VLSI circuits. The limitations for gang bonding chips with high lead counts and reduced pitches are increased bond forces and induced mechanical stress. Laser soldering is an alternative for such...
This paper reports the final results of a development project conducted on nitrogenbased atmospheres in order to improve the firing of copper thick films. Having shown that improvements in copper thick film performance can be obtained under production conditions by the control and regulation of...
Advanced laser micromachining techniques for a TFTLCD thin film transistorliquid crystal display module have been developed to repair various kinds of defects such as shorts, opens, and degraded TFTs. They have also been designed to analyse failures in the TFTLCD. The techniques are as follows i...
Introduction of curved boundaries in polygonally shaped integrated circuit planar resistors causes a crease in maximum electric field intensities and current densities present in them, and consequently decreases the likelihood of their failure. The presence of curved boundaries can also decrease...
Temperature field computations of hybrid power circuits require considerable numerical effort. This paper presents rules which show both how to limit the number of terms of the Fourier series and how to estimate the error which is the effect of this reduction.
This paper concerns an allsolidstate, highcontrast electroluminescent EL flat panel display which is becoming the potential for multifunctional avionic displays. In this ACTFEL a.c. thin film electroluminescent flat panel device, an active layer, doped with manganese ZnSMn is sandwiched between...
Silver and other metals can exhibit dendritic shortcircuit growth caused by electrochemical migration in conductorinsulator structures. Detailed analysis of migrationfree thick film systems using migrationfree conductors has demonstrated that not only metallic components, but also dielectric...
ISHM, acting as a professional body for a very large sector of microelectronics manufacturing and design, naturally takes a strong and active interest in the education and training of people working in its industry. An annual Education Prize is awarded by the Society at either undergraduate or...
At the Annual General Meeting of ISHMFrance, held on 12 June 1991, the following were elected
Read and print from thousands of top scholarly journals.
Continue with Facebook
Sign up with Google
Log in with Microsoft
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Sign Up Log In
To subscribe to email alerts, please log in first, or sign up for a DeepDyve account if you don’t already have one.
To get new article updates from a journal on your personalized homepage, please log in first, or sign up for a DeepDyve account if you don’t already have one.