1 - 6 of 6 articles
Purpose – To provide modeling approaches of increasing levels of complexity for the analysis of convective heat transfer in microchannels which offer adequate descriptions of the thermal performance, while allowing easier manipulation of microchannel geometries for the purpose of design...
Purpose – To determine the optimal dimensions for a stacked micro‐channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach – GA is used as an optimization tool for optimizing the thermal resistance of a stacked micro‐channel under different flow...
Purpose – To analyze two‐phase flow in micro‐channel heat exchangers used for high flux micro‐electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and non‐uniform micro‐channel base heat fluxes are considered....
Purpose – In the semiconductor electronics industry, effective heat removal from the integrated circuits (IC) chip, through the electronic package to the environment is crucial to maintain an allowable junction temperature of the IC chip. Thermal performances of such electronic packages are...
Purpose – To numerically model forced convection heat transfer over arrays of solder balls. Design/methodology/approach – The characteristic based split (CBS) scheme has been used to solve the incompressible Navier‐Stokes equations on unstructured meshes. Findings – The results show an increase...
Purpose – To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach – A detailed finite element formulation for the triple stack cold plate with and without heat losses from the top and bottom surfaces of the stack is presented to determine...
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