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E. Mattsson, J. Bockris (1959)
Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate systemTransactions of The Faraday Society, 55
J.S. Newman (1991)
Electrochemical Systems
Current distribution measurements in through-hole electrodeposition were made on sectioned copper electrodes in a cylindrical flow channel. Two copper plating solutions with the same copper sulfate concentration but with different sulfuric acid concentrations were used. Experiments were conducted potentiostatically and under steady-state conditions. Results were compared with those from the theoretical model.
Journal of Applied Electrochemistry – Springer Journals
Published: Oct 16, 2004
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