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Modelling of through-hole electrodeposition Part II: Experimental study

Modelling of through-hole electrodeposition Part II: Experimental study Current distribution measurements in through-hole electrodeposition were made on sectioned copper electrodes in a cylindrical flow channel. Two copper plating solutions with the same copper sulfate concentration but with different sulfuric acid concentrations were used. Experiments were conducted potentiostatically and under steady-state conditions. Results were compared with those from the theoretical model. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Applied Electrochemistry Springer Journals

Modelling of through-hole electrodeposition Part II: Experimental study

Journal of Applied Electrochemistry , Volume 31 (6) – Oct 16, 2004

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References (2)

Publisher
Springer Journals
Copyright
Copyright © 2001 by Kluwer Academic Publishers
Subject
Chemistry; Physical Chemistry; Industrial Chemistry/Chemical Engineering
ISSN
0021-891X
eISSN
1572-8838
DOI
10.1023/A:1017550129955
Publisher site
See Article on Publisher Site

Abstract

Current distribution measurements in through-hole electrodeposition were made on sectioned copper electrodes in a cylindrical flow channel. Two copper plating solutions with the same copper sulfate concentration but with different sulfuric acid concentrations were used. Experiments were conducted potentiostatically and under steady-state conditions. Results were compared with those from the theoretical model.

Journal

Journal of Applied ElectrochemistrySpringer Journals

Published: Oct 16, 2004

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