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Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Journal of Materials Science , Volume 42 (13) – Jul 1, 2007

Details

Publisher
Kluwer Academic Publishers-Plenum Publishers
Copyright
Copyright © 2007 by Springer Science+Business Media, LLC
Subject
Chemistry; Mechanics ; Crystallography ; Continuum Mechanics and Mechanics of Materials; Polymer Sciences ; Characterization and Evaluation of Materials; Materials Science
ISSN
0022-2461
eISSN
1573-4803
D.O.I.
10.1007/s10853-006-1234-x
Publisher site
See Article on Publisher Site
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