Filter

  • Advanced Filters:

  • to
  • Specific Data Sources:

    All Edit

    Select All  |  Select None

Reset filters

DeepDyve - Search, Rent, Read
The easiest way for you to get scholarly articles:

  • Millions of articles from over 6,000 authoritative journals.
  • Get any 40 rentable articles for just $40 a month.
  • Read rented articles for an entire year.
  • Unused rentals get rolled over.

Bookmark

Void Nucleation and Growth during Plane Strain Extrusion

Preview Only

Void Nucleation and Growth during Plane Strain Extrusion

Abstract

A unit cell approach is pursued to investigate the effects of defects such as voids or rigid particles leading to voids on deformation and stress histories during plane strain extrusion processes. Particular attention is paid to the phenomenon of void nuclea tion from a rigid particle and the subsequent evolution of the void during an extrusion pro cess. Contact between the void surface and its nucleating particle is taken into account and is found to be important for such forming processes. It is observed that the aspect ratio of the void can change drastically. The stress and strain fields in the vicinity of such defects are significantly influenced by these distortions. Accordingly, the distortions play impor tant roles in determining the development of stress and strain fields and the possibility for coalescence of microvoids. In plane strain extrusions with voids present from the begin ning, concentrations of stress and strain fields due to distortions of void are observed to develop strongly while the void volume fraction decreases under the highly compressive loading.
Loading next page...
1 Page

Preview Only. This article cannot be rented because we do not currently have permission from the publisher.

 
/lp/sage/void-nucleation-and-growth-during-plane-strain-extrusion-6BgKVGldHS
Title
Void Nucleation and Growth during Plane Strain Extrusion
Author(s)
Chandra,Abhijit; Tvergaard,Viggo
Journal
International Journal of Damage Mechanics , Volume 2 (4): 330 SAGE – Oct 1, 1993
Publisher
Sage Publications
Copyright
Copyright © 1993 by SAGE Publications
ISSN
1056-7895
eISSN
1056-7895
D.O.I.
10.1177/105678959300200402
Publisher site
Get PDF