New Metallized Materials for EMI/RFI Shielding
Abstract
New Metallized Materials for EMI/RFI Shielding SAGE Publications, Inc.1992DOI: 10.1177/152808379202100305 Luc De Temmerman Monsanto Europe SA Rue Laid Burniat B-1348 Louvain-la-Neuve Belgium NEW DEVELOPMENTS IN the field of electroless plating have enabled the N introduction of metallized fabrics of superior conductivity, ductility, and ease of handling. The main application fields of these products include EMI/RFI shielding, antistat garments, infra-red reflectors, and lightning strike protection. Copper plated fabrics have a typical surface resistivity less than 0.1 ohm/sq and an 80-90 dB shielding, which is comparable to the shielding obtained with a foil containing the same weight of copper. The metal layers have some unusually good physical properties comparable to the features of the bulk metal. For example, submicron thick layers of electroless copper have ductilities of about 10% and are resistant to oxidation. Moreover, strong adherent metal layers are obtained without sacrificing the original mechanical properties of the substrate, thanks to the high ductility of the metal coating. TECHNOLOGY AND PRODUCTS The process for making Flectronrm metallized materials provides high adhesive strengths between substrate and metal layer without chemical swelling or acid etching treatments. Consequently, substrates of a delicate chemical nature or extremely fine geometry can be metallized by