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Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

Hindawi Publishing CorporationJun 1, 2008

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Title
Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Journal
Hindawi Publishing Corporation – Jun 1, 2008
Publisher
Hindawi Publishing Corporation
Copyright
Copyright © 2008 Sibylle Dieckerhoff et al.
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