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References (8)
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- Publisher
- Emerald Publishing
- Copyright
- Copyright © 2004 Emerald Group Publishing Limited. All rights reserved.
- ISSN
- 0954-0911
- DOI
- 10.1108/09540910410537318
- Publisher site
- See Article on Publisher Site
Abstract
This paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate for various plating schemes. The basic structure of the under bump metallisation is Cu/Ni/Au. Three different kinds of electroless plating solutions are used to deposit the Ni layer, namely, Ni‐B, Ni‐P (5 per cent), and Ni‐P (10 per cent). Also, conventional electrolytic Ni/Au plating is performed to provide a benchmark. After solder ball attachment, mechanical tests are conducted to characterize the ball shear strength for comparison. Furthermore, some specimens are subjected to multiple reflows to investigate the thermal aging effect.
Journal
Soldering & Surface Mount Technology – Emerald Publishing
Published: Aug 1, 2004
Keywords: Product reliability; Solders; Shear strength; Semiconductor technology