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Nduka Ekere, I. Ismail, E. Lo, S. Mannan (1993)
Experimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow solderingJournal of Electronics Manufacturing, 03
J.S. Hwang
Solder/screen printing
J.S. Hwang
Solder Paste in Electronic Packaging : Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly
Martin Marietta Corporation
Workmanship Standards: Surface Mount ‐ Solder Application
J. Morris, T. Wojcik (1990)
Stencil Printing of Solder Paste for Fine‐pitch Surface Mount AssemblySoldering & Surface Mount Technology, 2
D.C. Montgomery
Design and Analysis of Experiments
S.K. Buttars
Parameters of solder paste printing for fine pitch components
G. Derringer, R. Suich (1980)
Simultaneous Optimization of Several Response VariablesJournal of Quality Technology, 12
Nduka Ekere, E. Lo, S. Mannan (1994)
Process Modelling Maps for Solder Paste PrintingSoldering & Surface Mount Technology, 6
I. Ismail, S. Mannan, Nduka Ekere, E. Lo (1993)
Experimental Study of the Printing of Solder Paste Using the Metal Blade Squeegee System
The objectives of this research are to model the screening process with planned experiments and to identify the optimal setting of the process parameters so as to minimize the printing defects. The percentage volume matching (PVM) and defects per unit (DPU) are the two quality characteristics of interest. A fractional factorial design was employed to study simultaneously the effects of eight process factors on the PVM and DPU and their possible interactions. Subsequent analysis shows that a low level of the stencil cleaning interval and low temperature results in the minimum DPU while maintaining a PVM very close to 100 per cent. Empirical relationships between these two quality characteristics and the important factors were formulated using regression analysis and close matches were found during subsequent validation experiments.
Soldering & Surface Mount Technology – Emerald Publishing
Published: Dec 1, 1999
Keywords: Solder paste; Stencil printer; Optimization
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