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Flip-chip packaging solution for CMOS image sensor device

Microelectronics Reliability , Volume 44 (1) – Jan 1, 2004

Details

Publisher
Elsevier
Copyright
Copyright © 2003 Elsevier Science Ltd
ISSN
0026-2714
eISSN
1872-941X
D.O.I.
10.1016/S0026-2714(03)00191-4
Publisher site
See Article on Publisher Site
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