Editorial: Special Issue on 3D Integrated Circuits and Microarchitectures This special issue of the ACM Journal of Emerging Technologies in Computing Systems is dedicated to three-dimensional integrated circuits and microarchitectures. Three-dimensional (3D) Integrated Circuits have emerged as an attractive option for overcoming the barriers in interconnect scaling. To ef ciently exploit the bene ts of 3D technologies, design techniques and methodologies for supporting 3D designs are imperative; design space exploration at the architectural level is also essential to fully take advantage of the 3D integration technologies and build a high performance chip. A call for papers for the JETC special issue was announced in August 2007. All submissions went through the regular review process of JETC. After review and appropriate revisions, ve papers on diverse topics related to 3D integration were accepted for the special issue. In the rst article of this special issue, Kgil et al. describe a new architecture design called PicoServer, which employs 3D technology to bond ChipMultiprocessors (CMPs) die to multiple DRAM memory dies suf cient for a primary memory. The use of 3D stacks facilitates wide low-latency buses between processors and memory and removes the need for L2 caches. Such architecture enables the
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Editorial: Special issue on 3D integrated circuits and microarchitectures
Xie, Yuan; Cong, Jason; Franzon, Paul
Follow ACM Journal on Emerging Technologies in Computing Systems (JETC)
, Volume 4 (4)
Association for Computing Machinery – Oct 1, 2008
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