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Soldering and Surface Mount Technology Volume 13 Issue 3

2013
- Volume 25
  - Issue 2 (Apr)
  - Issue 1 (Feb)
2012
- Volume 24
2011
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2010
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2009
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2008
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2007
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2006
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2005
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Soldering and Surface Mount Technology Volume 13 Issue 3

The effect of PECVD SiN x moisture barrier layers on the degradation of a flip chip underfill material

G. Kaltenpoth; W. Siebert; X‐M. Xie; F. Stubhan

Follow Soldering & Surface Mount Technology , Volume 13 (3): 4 Emerald Publishing – Dec 1, 2001

Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders

L. Ye; Z.H. Lai; J. Liu; A. Thölén

Follow Soldering & Surface Mount Technology , Volume 13 (3): 5 Emerald Publishing – Dec 1, 2001

Ceramic chip scale package solder joint reliability

J. Seyyedi; J. Padgett

Follow Soldering & Surface Mount Technology , Volume 13 (3): 5 Emerald Publishing – Dec 1, 2001

Lead‐free reflow soldering for electronics assembly

M.R. Harrison; J.H. Vincent; H.A.H. Steen

Follow Soldering & Surface Mount Technology , Volume 13 (3): 18 Emerald Publishing – Dec 1, 2001

ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges

Johan Liu

Follow Soldering & Surface Mount Technology , Volume 13 (3): 19 Emerald Publishing – Dec 1, 2001

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Soldering and Surface Mount Technology Volume 13 Issue 3

1 - 5 of 5 articles

G. Kaltenpoth; W. Siebert; X‐M. Xie; F. Stubhan

Follow Soldering & Surface Mount Technology , Volume 13 (3): 4 Emerald Publishing – Dec 1, 2001

L. Ye; Z.H. Lai; J. Liu; A. Thölén

Follow Soldering & Surface Mount Technology , Volume 13 (3): 5 Emerald Publishing – Dec 1, 2001

J. Seyyedi; J. Padgett

Follow Soldering & Surface Mount Technology , Volume 13 (3): 5 Emerald Publishing – Dec 1, 2001

M.R. Harrison; J.H. Vincent; H.A.H. Steen

Follow Soldering & Surface Mount Technology , Volume 13 (3): 18 Emerald Publishing – Dec 1, 2001

Follow Soldering & Surface Mount Technology , Volume 13 (3): 19 Emerald Publishing – Dec 1, 2001