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Circuit World

2013
- Volume 39
  - Issue 1 (Feb)
2012
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2011
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2010
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2009
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2008
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2007
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Circuit World

Printed circuit board technologies for thermal management

William Burr; Nick Pearne; Francesca Stern

Follow Circuit World , Volume 39 (1): 4 Emerald Publishing – Feb 1, 2013

Analysis of structure characteristics of a flying probe tester

Chuji Chen; Hongyan Shi; Fumin Song

Follow Circuit World , Volume 39 (1): 11 Emerald Publishing – Feb 1, 2013

The impact of carbon content and mesh on the characteristics of screen printed conductive structures

E.H. Jewell; S.M. Hamblyn; T.C. Claypole; D.T. Gethin

Follow Circuit World , Volume 39 (1): 9 Emerald Publishing – Feb 1, 2013

Development of new laminates for high performance interconnection technology in avionics applications

C.R. Raghunath; U. Raghunath; H.S. Yeshaswini; H. Rashmi

Follow Circuit World , Volume 39 (1): 9 Emerald Publishing – Feb 1, 2013

Manufacture of an aluminum rigid‐flex circuit assembly without the use of solder

Joseph Fjelstad

Follow Circuit World , Volume 39 (1): 5 Emerald Publishing – Feb 1, 2013

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William Burr; Nick Pearne; Francesca Stern

Follow Circuit World , Volume 39 (1): 4 Emerald Publishing – Feb 1, 2013

Chuji Chen; Hongyan Shi; Fumin Song

Follow Circuit World , Volume 39 (1): 11 Emerald Publishing – Feb 1, 2013

E.H. Jewell; S.M. Hamblyn; T.C. Claypole; D.T. Gethin

Follow Circuit World , Volume 39 (1): 9 Emerald Publishing – Feb 1, 2013

C.R. Raghunath; U. Raghunath; H.S. Yeshaswini; H. Rashmi

Follow Circuit World , Volume 39 (1): 9 Emerald Publishing – Feb 1, 2013

Follow Circuit World , Volume 39 (1): 5 Emerald Publishing – Feb 1, 2013